Method of bonding a semiconductor chip to a substrate

Details Method of bonding a semiconductor chip to a substrate Method of bonding a semiconductor chip to a substrate

1986-07-14

1988-12-27

Simmons, David

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156238, 156247, 156248, 156249, 156257, 156268, B32B 3126

Patent

active

047938838

ABSTRACT:
The bonding of semiconductor chips to a substrate is described wherein the first step involves the bonding of a tacky, curable and partially cured chip bonding adhesive, which is releasably supported on a support film, to the surface of the chip intended to be bonded to the substrate. The second step involves the further partial heat curing of the adhesive to convert it to a non-tacky state so that the adhesive will not undesirably stick during handling and storage operations. Thereafter, the chip with its adherent adhesive can be mounted to a substrate at elevated temperature to convert the adhesive to a more tacky state. The final step involves the curing of the adhesive after it has been used to bond the chip to the substrate.

REFERENCES:
patent: 3554832 (1971-01-01), Fischer
patent: 3600246 (1971-08-01), Breen
patent: 4284457 (1981-08-01), Stonier et al.
patent: 4606962 (1986-08-01), Reylek et al.
patent: 4664739 (1987-05-01), Aurichio

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