Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2003-08-25
2009-10-20
Mulpuri, Savitri (Department: 2812)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C438S099000, C438S780000, C438S795000, C257SE21480, C257SE21519
Reexamination Certificate
active
07605050
ABSTRACT:
The invention relates to a method of bonding a polymer surface to an electrically conductive or semiconductive surface, which method is characterized in that it comprises:a) the electrografting of an organic film onto the conductive or semiconductive surface; and thenb) an operation of bonding the polymer surface to the conductive or semiconductive surface thus grafted.It also relates to applications of this method and to structures obtained by its implementation.
REFERENCES:
patent: 4421569 (1983-12-01), Dichter et al.
patent: 4547270 (1985-10-01), Naarmann
patent: 5284543 (1994-02-01), Kusano et al.
patent: 6022597 (2000-02-01), Yan et al.
patent: 6287687 (2001-09-01), Yializis et al.
patent: 6306975 (2001-10-01), Zhao et al.
patent: 6335571 (2002-01-01), Capote et al.
patent: 6566170 (2003-05-01), Marion et al.
patent: 2001/0005738 (2001-06-01), Bruchmann et al.
patent: 0152573 (1981-12-01), None
patent: 0701802 (1996-03-01), None
patent: 0761320 (1997-03-01), None
patent: 1110946 (2001-06-01), None
patent: 2780200 (1999-12-01), None
patent: 2781232 (2000-01-01), None
patent: WO 98/32474 (1998-07-01), None
patent: WO 98/49206 (1998-11-01), None
patent: WO 99/16907 (1999-04-01), None
patent: WO 00/51732 (2000-09-01), None
patent: WO 02/098926 (2002-12-01), None
Plueddemann et al. “Fundamentals of Adhesion:Adhesion Through Silane Coupling Agents” L.H. Lee (Editor) Plenum Press, New York 9:279-290 (1990).
Sintzel et al. 'Synthesis and characterization of self-catalyzed poly(ortho ester)Biomaterials19:791-800 (1998).
Lou et al. “Electrografting of Preformed Aliphatic Polyesters onto Metallic Surfaces”Langmuir, ACS, Washington D.C. 18:2785-2788 (2002).
Bureau Christophe
Charlier Julienne
Alchimer S.A.
Commissariat A L'Energie Atomique
Lee Cheung
McKenna Long & Aldridge LLP
Mulpuri Savitri
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