Method of bonding a microelectronic device

Details Method of bonding a microelectronic device Method of bonding a microelectronic device

1988-04-13

1994-04-12

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437183, 228 11, 228 45, 219 5622, 219 8661, 257746, H01L 21607

Patent

active

053025504

ABSTRACT:
A method for ball-bonding thin film structures. The bonding characteristics of a thin-film electrode structure are measured, before the actual bonding step, by pressing a ball (of a material similar to that of the bonding wire) against an electrode by a bonding capillary, and then measuring the resultant indentation of the electrode. The depth of this test indentation of the electrode has a good correlation with the bondability.

REFERENCES:
patent: 4732313 (1988-03-01), Kobayashi et al.
"Copper bonding could outshine gold", C. Cohen, Electronics, Jul. 25, 1985, pp. 27-28.
"Ultrasonic Hardness Testing", G. Kossoff et al., Ultrasonics, Apr. 1968, pp. 88-91.
Johnson et al. "Development of Aluminum Ball/Wedge Wire Welding" Int. J. Hybrid Microelectron, vol. 4, No. 1, Spring 1981.

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