Metal fusion bonding – Process – With pretreating other than heating or cooling of work part...
Patent
1993-05-27
1994-04-26
Heinrich, Samuel M.
Metal fusion bonding
Process
With pretreating other than heating or cooling of work part...
228207, 228217, 148 25, 29841, B23K 35363, B23K 3538, H01L 2150, H01L 2154
Patent
active
053059484
ABSTRACT:
The solder bonding is conducted by applying a postflux, which contains halogen compounds in the ratio of 0.2% or less as the amount of halogen, over a metal surface, which is the portion to be bonded by solder, of a member including metal accommodated in a gas-impermeable container in a hermetically sealed manner together with a rust-proof agent packet. The method of the present invention prevents, in an extremely simple way and at a low cost, the oxidation of the metal surface by retaining the member including the metal under a reductive atmosphere in which no oxygen, moisture or corrosive substances actually exist, and in which reductive gas co-exists with the material including the metal member, and the use of the flux containing a small amount of halogen easily enables good bonding properties of the solder. Accordingly, it is unnecessary to remove the flux by organic halogen based solvents after the solder bonding, the cleaning steps may be simplified and cost reduction may be promoted.
REFERENCES:
patent: 3086893 (1963-04-01), Konig
patent: 3973322 (1976-08-01), Boynton
patent: 4908151 (1990-03-01), Inoue et al.
"No-Clean Fluxes are a Viable Alternative to CFC Cleaning", Electronic Packing and Production, vol. 30, No. 6, Jun. 1990, pp. 95-98.
Fujinami Kazuo
Inoue Yoshiaki
Takeuchi Teruo
Yoshikawa Yoshio
Heinrich Samuel M.
Mitsubishi Gas Chemical Company Inc.
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