Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent
1999-09-17
2000-12-26
Chaudhuri, Olik
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
438119, 438123, 438124, 438127, 438612, 438613, H01L 2148
Patent
active
061658170
ABSTRACT:
The present invention is directed to a semiconductor package and its method of manufacture. Conductors mounted on a flexible polymer tape are used to connect a semiconductor chip to a substrate. The flexible polymer tape can be folded back under the chip to reduce the size necessary for mounting the assembly to almost that of the chip itself. The polymer tape also provides flexibility to reduce stresses on the electrically connections caused by thermal expansion and compression. Additionally, the present invention allows for the stacking of semiconductor chips on top of one another, reducing signal propagation delays between them.
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Akram Salman
Farnworth Warren M.
Chambliss Alonzo
Chaudhuri Olik
Micro)n Technology, Inc.
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