Method of bonding a dielectric substrate to a metallic carrier i

Details Method of bonding a dielectric substrate to a metallic carrier i Method of bonding a dielectric substrate to a metallic carrier i

1976-09-22

1977-12-06

Kelly, Donald G.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228165, 228170, B23K 3102

Patent

active

040612635

ABSTRACT:
The method comprises the steps of plating at least one surface of the substrate with a metal with the one surface of the substrate to be bonded to a given surface of the metallic carrier, forming a plurality of vent holes in the given surface, tinning the plated one surface and the given surface separately with solder, cleaning the tinned plated one surface and the tinned given surface separately to clean both of the tinned surfaces, applying a flux to both of the cleaned tinned surfaces separately, placing both of the fluxed cleaned tinned surfaces in contact with each other, applying heat and pressure simultaneously to both of the substrate and the carrier until the solder of both of the fluxed cleaned tinned surfaces flows, and cooling both of the substrate and the carrier in a natural manner to room temperature while still applying the pressure to both the substrates to the carrier. The plurality of vent holes remove excess flux and solder during the step of applying heat and pressure to provide an intimate bonded contact between both of the surfaces and to prevent the solder from flowing onto undesirable areas.

REFERENCES:
patent: 1956233 (1934-04-01), Braun
patent: 2149008 (1939-02-01), Chapman
patent: 3279284 (1966-10-01), Ogden
patent: 3284176 (1966-11-01), Reed
patent: 3337947 (1967-08-01), Terrill
patent: 3363308 (1968-01-01), Lueck
patent: 3390447 (1968-07-01), Mears
patent: 3648357 (1972-03-01), Green, Jr.
patent: 3921885 (1975-11-01), Knox

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