Method of bonding a die to a substrate

Details Method of bonding a die to a substrate Method of bonding a die to a substrate

1985-09-26

1987-04-21

Ramsey, Kenneth J.

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228203, 228232, 228254, B23K 120, B23K 3100

Patent

active

046590064

ABSTRACT:
A typical method for bonding a die to a substrate includes the steps of placing a solder preform onto the substrate, contacting the die to the preform and applying heat sufficient for the solder to flow and wet the substrate and die forming a bond therebetween. The present invention comprises heating the substrate and preform to a temperature below the melting point of the solder preform and thereafter maintaining this temperature while applying pressure to the preform sufficient to substantially reduce the thickness of the preform and to cause the preform to adhere to the substrate prior to contacting the die thereto.

REFERENCES:
patent: 3611555 (1971-10-01), Nier
patent: 3641663 (1972-02-01), Osoegawa et al.
patent: 3883496 (1975-05-01), Dale
patent: 4142662 (1979-03-01), Holbrook
patent: 4328491 (1982-05-01), Liang

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