Method of bonding a diamond substrate to at least one metal subs

Details Method of bonding a diamond substrate to at least one metal subs Method of bonding a diamond substrate to at least one metal subs

1997-10-30

1999-12-28

Ryan, Patrick

Metal fusion bonding

Process

Metal to nonmetal with separate metallic filler

228193, 228 447, 228 54, C23C 1200

Patent

active

060069791

ABSTRACT:
The invention concerns a method of bonding a diamond substrate to at least one metal substrate. According to the invention:

REFERENCES:
patent: 3922775 (1975-12-01), Potter
patent: 5197651 (1993-03-01), Nakamura et al.
patent: 5423475 (1995-06-01), Burke
B. Fiegl et al, "Diamond Films as Thermal Conductors and Electrical Insulators Applied to Semiconductor Power Modules", Diamond and Related Materials, vol. 3, No. 4/06, Apr. 1, 1994, pp. 658-662, XP000466679.
"Properties and Growth of Diamond 9EMIS Datareviews Series No. 9)", 1994, Inspec Publication, edited by Gordon Davies, London, GB XP002034103.

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