Method of bonding a contact-type thin film magnetic head element

Details Method of bonding a contact-type thin film magnetic head element Method of bonding a contact-type thin film magnetic head element

1996-01-30

1997-10-14

Heinrich, Samuel M.

Metal fusion bonding

Process

Using high frequency vibratory energy

G11B 531

Patent

active

056763042

ABSTRACT:
A method of bonding a contact-type thin film magnetic head element to a beam for supporting the head element in a contact-type thin film magnetic head during a process of producing the magnetic head is disclosed. A connecting pad of the magnetic head element is made contact with a signal conductor of the supporting beam. Then, a vibration energy of an ultrasonic wave is applied to the contact portion so that the surfaces of the components in the contact portion are caused to diffuse into each other. As a result, a state in which the connecting pad is mechanically coupled and electrically connected to the signal conductor is obtained.

REFERENCES:
patent: 4760481 (1988-07-01), Yuito et al.
patent: 4796132 (1989-01-01), Dekura et al.
patent: 5576098 (1996-11-01), Arimoto et al.
English Language Summary of JP-6-150250 (31-5-1994) "Thin Film Magnetic Head and its Manufacture".
English Language Summary of JP-6-150251 (31-5-1994) "Contact Type Magnetic Head".

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