Method of bonding a chip part to a substrate using solder bumps

Details Method of bonding a chip part to a substrate using solder bumps Method of bonding a chip part to a substrate using solder bumps

1997-06-12

1999-11-16

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

2282341, 219209, 392418, B23K 3102, H05B 100, A61M 1600

Patent

active

059841656

ABSTRACT:
A method for bonding a chip part, having solder bumps on the underside thereof, to a base material. The method includes the steps of placing the chip part at a specific position on the base material, placing a weight on the chip part, the weight being based on the number of solder bumps mounted on the chip part and a surface tension of the solder bumps at melting, and irradiating, with an electromagnetic wave, an upper surface of the weight to transfer heat to the solder bumps through the weight and the chip, thereby melting the solder bumps and bonding the chip part to the base material.

REFERENCES:
patent: 3804691 (1974-04-01), Trivedi
patent: 3926360 (1975-12-01), Moister, Jr.
patent: 3964666 (1976-06-01), Dinella et al.
patent: 4607779 (1986-08-01), Burns
patent: 4771929 (1988-09-01), Bahr et al.
patent: 4792302 (1988-12-01), Baker et al.
patent: 4856702 (1989-08-01), Kloucek
patent: 4938409 (1990-07-01), Roberts
patent: 5148003 (1992-09-01), Haj-Ali-Ahmadi et al.
patent: 5305944 (1994-04-01), Yoshida et al.
patent: 5433368 (1995-07-01), Spigarelli
patent: 5532457 (1996-07-01), Cobb et al.
patent: 5607609 (1997-03-01), Sakuyama et al.
patent: 5626280 (1997-05-01), Ciambrone
patent: 5632434 (1997-05-01), Evans et al.
patent: 5648005 (1997-07-01), Cobb et al.
patent: 5770835 (1998-06-01), Sakuyama et al.
patent: 5844208 (1998-12-01), Tustaniwskyj et al.

Affiliated with

Also associated with

Rating

Method of bonding a chip part to a substrate using solder bumps does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of bonding a chip part to a substrate using solder bumps, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of bonding a chip part to a substrate using solder bumps will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1312908