Coating processes – Spraying – Moving the base
Patent
1993-12-08
1995-05-16
Beck, Shrive
Coating processes
Spraying
Moving the base
427209, 427421, 427425, 118108, 118314, 118320, 118322, 118324, B05D 102
Patent
active
054158982
DESCRIPTION:
BRIEF SUMMARY
FIELD OF THE INVENTION
The present invention relates to a method of blasting IC frames and an apparatus therefor which is used for removing burr or flash of synthetic resin attached to an oblong strip of IC frames wherein electronic devices are molded to a metallic plate made into lead.
BACKGROUND OF THE INVENTION
A method to mechanically and efficiently remove burr or flash of IC frames by spraying slurry from a nozzle device has been already known. In this method, in a device disclosed in Japanese Patent Publication No. 10578 of 1984 for instance, an IC frame is vertically held with both side edges thereof regulated not to move, while conveying the IC frame.
In the above mentioned method, any time an IC frame is caught by a restriction mechanism of a conveyor device during blasting treatment of said IC frames, or different kinds of IC frames having different widths are fed in the middle of the process, the restriction mechanism of the conveyor device has to be moved and adjusted, inconveniently. This becomes a factor greatly lowering the efficiency of continuous operations in a productive line. It is therefore an object of the present invention to solve the above problems.
SUMMARY OF THE INVENTION
According to a method of blasting IC frames of this invention, an endless conveyor belt, which has support plate members each having a notch of a inverted triangular shape juxtaposed thereon and has a support groove of an inverted triangular sectional shape formed thereon, is turned along a fixed track, and IC frames are intermittently fed to a conveyor starting position in the support groove, placed on one side of the support groove, on the slope surfaces of the support groove. In a fixed position during transfer of an IC frame, slurry is jetted onto the surface of the IC frame from a nozzle device, and a second fixed position the IC frame is turned along its lower hem by a reversion device and placed on the other slope surface of the support groove. Then, in a third fixed position slurry is jetted onto the surface the IC frame from another nozzle device.
In the above invention, the support groove is merely to support an IC frame placed on its inner surfaces of an inverted triangular shape. In this case, the IC frame is placed on the support groove with the lower hem thereof supported by the lowest part of the notches and the upper hem thereof free from any positional restriction. The IC frame is conveyed with the support groove in accordance with the movement of the support groove. Accordingly, neither the upper hem nor the lower hem of the IC frame is caught by a position restriction mechanism of a conveyor device during transfer, and any particular operation is not necessary even if frames of different widths are fed, because the upper hem of the IC frame is free from any positional restriction.
The present invention, wherein an IC frame is not caught by a position restriction mechanism of a conveyor device during transfer of the IC frame in the blasting treatment and any particular operation is not necessary even if different frames of different widths are fed, greatly effects the efficiency of continuous operations in a productive line.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an entire plan view of a device according to the present invention.
FIG. 2 is an entire front view of the device of FIG. 1.
FIG. 3 is a perspective view of a conveyor belt of the above device guided by a driven sprocket wheel.
FIG. 4a is a cross section, showing a working condition of a nozzle device taken along the line X--X in FIG. 1.
FIG. 4b is a cross section, showing a working condition of a nozzle device taken along the line Y--Y in FIG. 1.
FIG. 5 is a perspective view showing a working condition of a reversion device during movement of tire conveyor belt of the device of FIG. 1.
FIG. 6 shows an IC frame.
PREFERRED EMBODIMENTS OF THE PRESENT INVENTION
The present invention, as shown in FIGS. 1 and 2, comprises a conveyor device 1, a first nozzle device 2, a reversion device 3, and a second nozzle device 4.
The
REFERENCES:
patent: 4545155 (1985-10-01), Nakata
patent: 4561219 (1985-12-01), Harada et al.
patent: 4674238 (1987-06-01), Suzuki et al.
patent: 4760673 (1988-08-01), Tsuchiya
patent: 4958722 (1990-09-01), Kobayashi et al.
Ishii Mineo
Nakano Teruyuki
Beck Shrive
Kabushiki Gaisha Ishii Hyoki
Maiorana David M.
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