Method of bending outer leads of a semiconductor device

Details Method of bending outer leads of a semiconductor device Method of bending outer leads of a semiconductor device

1991-04-24

1992-07-07

Larson, Lowell A.

Wireworking

Crimping

B21F 100

Patent

active

051274477

ABSTRACT:
A method of bending outer leads of a semiconductor device, wherein the outer leads arranged substantially horizontally are preparatorily bent upward or downward from their roots, and thereafter bent into a predetermined configuration, thereby to obtain final outer leads.

REFERENCES:
patent: 4829669 (1989-05-01), Nakajima
patent: 4957146 (1990-09-01), Satterfield et al.
patent: 5078186 (1992-01-01), Togashi et al.

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