Method of beam lead bonding

Details Method of beam lead bonding Method of beam lead bonding

1975-01-13

1976-12-14

Husar, Francis S.

Metal fusion bonding

Process

Plural joints

228 41, 29577, B23K 1904

Patent

active

039971007

ABSTRACT:
An electrical circuit structure formed by bonding an integrated circuit, which has a plurality of conductive leads formed substantially coplanar with one surface of the semiconductor integrated circuit chip, to a pattern of conductive lines formed on the surface of a substrate having an insulating surface by positioning the leads adjacent the surface of the substrate supporting the conductive lines with portions of the conductive leads overlapping portions of the conductive lines and bonding said portions together by welding while exerting a substantially uniform weld deformation pressure on each of said conductive lead portions to deform said conductive lead portions to a predetermined degree.

REFERENCES:
patent: 3317287 (1967-05-01), Caracciolo
patent: 3505726 (1970-04-01), Kleinedler et al.
patent: 3515333 (1971-04-01), Kulicke et al.

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