Method of base formation in a BiCMOS process

Active solid-state devices (e.g. – transistors – solid-state diode – Heterojunction device – Bipolar transistor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S370000, C257S378000, C257S273000, C257S526000

Reexamination Certificate

active

06911681

ABSTRACT:
Disclosed is a bipolar complementary metal oxide semiconductor (BiCMOS) or NPN/PNP device that has a collector, an intrinsic base above the collector, shallow trench isolation regions adjacent the collector, a raised extrinsic base above the intrinsic base, a T-shaped emitter above the extrinic base, spacers adjacent the emitter, and a silicide layer that is separated from the emitter by the spacers.

REFERENCES:
patent: 4808548 (1989-02-01), Thomas et al.
patent: 5017990 (1991-05-01), Chen et al.
patent: 5106767 (1992-04-01), Comfort et al.
patent: 5107321 (1992-04-01), Ilderem et al.
patent: 5144403 (1992-09-01), Chiang et al.
patent: 5439833 (1995-08-01), Hebert et al.
patent: 5580798 (1996-12-01), Grubisich
patent: 5599723 (1997-02-01), Sato
patent: 5607866 (1997-03-01), Sato et al.
patent: 5661046 (1997-08-01), Ilderem et al.
patent: 5940711 (1999-08-01), Zambrano
patent: 5953600 (1999-09-01), Gris
patent: 5986323 (1999-11-01), Zambrano et al.
patent: 5986326 (1999-11-01), Kato
patent: 6028345 (2000-02-01), Johnson
patent: 6316818 (2001-11-01), Marty et al.
patent: 6465317 (2002-10-01), Marty
patent: 6492238 (2002-12-01), Ahlgren et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of base formation in a BiCMOS process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of base formation in a BiCMOS process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of base formation in a BiCMOS process will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3477580

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.