Method of ball forming for wire bonding

Details Method of ball forming for wire bonding Method of ball forming for wire bonding

1986-01-31

1987-11-10

Ramsey, Kenneth J.

Metal fusion bonding

Process

Plural joints

219 5622, 219 69M, H01L 2160

Patent

active

047052040

ABSTRACT:
A ball-type bonding wire for use in connecting electrodes of semiconductor devices with external connector terminals and a method for producing such a wire in which the material of the wire can be a material such as aluminum, copper, palladium, alloys thereof, and combinations thereof. In forming the wire, the tip of the wire is disposed opposite a consumable electrode in an inert atmosphere, and a voltage is applied between the wire and the electrodes so as to cause a discharge between the tip of the wire and the consumable electrode. The polarity of this voltage is such that the majority of the energy contained in the discharge and supplied to the wire is produced when the wire is positive with respect to the consumable electrode.

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patent: 4459452 (1984-07-01), Carter
patent: 4476366 (1984-10-01), Kurtz et al.
patent: 4564734 (1986-01-01), Okikawa

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