Method of ball bonding to non-wire bonded electrodes of semicond

Details Method of ball bonding to non-wire bonded electrodes of semicond Method of ball bonding to non-wire bonded electrodes of semicond

1991-01-09

1992-06-23

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437183, 228179, 228904, H01L 21283

Patent

active

051242770

ABSTRACT:
In an internal wire bonding section of a semiconductor device, electrodes pads (e.g., Al pads) which are not connected to leads are ball-bonded with metallic balls (e.g., Au balls) to improve moisture resistance and to thereby reduce the rate of corrosion of internal portions of the semiconductor device. The operation of the semiconductor device manufacturing apparatus for ball bonding conforms to the conventional wire bonding operation, so that the existing process can be used without significantly improving the apparatus or significantly changing the semiconductor manufacturing method.

REFERENCES:
patent: 4442967 (1984-03-01), Vander Pas et al.
patent: 4661192 (1987-04-01), McShane

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