Method of avoiding peeling on wafer edge and mark number

Details Method of avoiding peeling on wafer edge and mark number Method of avoiding peeling on wafer edge and mark number

1998-06-16

1999-12-28

Young, Christopher G.

Radiation imagery chemistry: process, composition, or product th

Including control feature responsive to a test or measurement

G03F 900

Patent

active

060079533

ABSTRACT:
The invention provides a method of avoiding peeling on the wafer edge and the mark number. The method uses a design rule to expose the multi-layer on a wafer. The limit and the scope of the exposed distance are taken to ensure the polysilicon layers and the metal layers are covered by the dielectric layer after exposure. The polysilicon layers or the metal layers don't unclothe from the overlarge distance at the exposed dielectric layer, so the next structure formed on the exposed dielectric layer doesn't peeling from contacting with the polysilicon layer or the metal layer. The invention avoids to contaminate the wafer and the machine after the particles forming from peeling.

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