Method of automatically chamfering a wafer and apparatus therefo

Details Method of automatically chamfering a wafer and apparatus therefo Method of automatically chamfering a wafer and apparatus therefo

1989-07-19

1992-06-02

Rose, Robert A.

Abrasive tool making process, material, or composition

Impregnating or coating an abrasive tool

51101R, 51215CP, 51215UE, B24B 906

Patent

active

051175908

ABSTRACT:
A method of automatically chamfering a wafer and an apparatus therefor are disclosed. The method comprises the steps of supplying a wafer, positioning and setting the wafer on working stages, chamfer-machining the wafer on the working stages, and recovering the wafer, all the steps being continuously performed on a full-automatic basis. The apparatus comprises a wafer supply means, a wafer positioning and setting means, a chamfer-machining means for the wafer, a wafer recovering means, and a wafer transferring means. Since the method and apparatus therefor enables performance of a series of those operations on a continuous and full-automatic basis, it is possible to enhance the operating efficiency and machining ability and, at the same time, to achieve manpower reduction.

REFERENCES:
patent: 4002246 (1977-01-01), Brandt et al.
patent: 4638601 (1987-01-01), Steere et al.
C. G. Metreaud, Article Handling System, IBM Technical Disclosure Bulletin, Dec. 1966, vol. 9, No. 7, pp. 953-954.

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