Method of attaching printhead integrated circuits to an ink...

Details Method of attaching printhead integrated circuits to an ink... Method of attaching printhead integrated circuits to an ink...

2008-03-17

2010-06-01

Nguyen, Khanh (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S060000, C156S182000

Reexamination Certificate

active

07727348

ABSTRACT:
A method of attaching one or more printhead integrated circuits to an ink supply manifold. The method comprises the steps of: (a) providing a laminated film having a plurality of ink supply holes defined therein, the laminated film comprising a central polymeric film sandwiched between first and second adhesive layers, wherein a first melt temperature of the first adhesive layer is at least 20° C. less than a second melt temperature of the second adhesive layer; (b) aligning the film with the ink supply manifold such that each ink supply hole is aligned with a respective ink outlet defined in a manifold bonding surface of the ink supply manifold; (b) bonding the first adhesive layer to the manifold bonding surface by applying heat and pressure to an opposite side of the film; (c) aligning the printhead integrated circuits with the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of each printhead integrated circuit; and (d) bonding the printhead integrated circuits to the second adhesive layer.

REFERENCES:
patent: 7225739 (2007-06-01), Silverbrook et al.
patent: 2003/0178221 (2003-09-01), Chiu et al.
patent: 2007/0058007 (2007-03-01), Silverbrook et al.
patent: 2007/0206059 (2007-09-01), Ramachandra et al.
patent: 0671372 (1995-09-01), None
patent: 2007/098861 (2007-04-01), None

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