Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2006-04-11
2006-04-11
Gray, Linda (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C156S153000, C156S268000, C156S272800, C156S293000, C156S298000, C156S513000, C156S514000, C385S014000, C029S830000, C174S250000
Reexamination Certificate
active
07025849
ABSTRACT:
Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.
REFERENCES:
patent: 6882762 (2005-04-01), Brist et al.
patent: 2002/0051599 (2002-05-01), Tsukamoto et al.
Cho Young-Sang
Kim Young-Woo
Yang Dek-Gin
Yim Kyu-Hyok
Gottlieb Rackman & Reisman P.C.
Gray Linda
Samsung Electro-Mechanics Co. Ltd.
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