Method of attaching optical waveguide component to printed...

Details Method of attaching optical waveguide component to printed... Method of attaching optical waveguide component to printed...

2006-04-25

2006-04-25

Gray, Linda (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S268000, C156S293000, C156S298000, C156S513000, C385S014000, C029S830000, C174S250000

Reexamination Certificate

active

07033457

ABSTRACT:
Disclosed is a method of attaching an optical waveguide component to a printed circuit board, which is a double-sided or a multilayer printed circuit board, through pre-bonding and main-bonding by use of an adhesive tape. Prior to being attached to the printed circuit board, the optical waveguide component is preferably subjected to a plasma surface treatment to give a surface roughness thereto. The present method is advantageous in that the optical waveguide component can be attached to the printed circuit board with improved flatness and precise alignment without causing chemical or thermal damage to the optical waveguide component.

REFERENCES:
patent: 6882762 (2005-04-01), Brist et al.
patent: 2002-258088 (2002-09-01), None
patent: 2003-215374 (2003-07-01), None

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