Method of attaching non-adhesive thermal interface materials

Details Method of attaching non-adhesive thermal interface materials Method of attaching non-adhesive thermal interface materials

2006-03-28

2006-03-28

Chérvinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S707000, C257S706000, C257S712000, C165S080300, C165S185000

Reexamination Certificate

active

07019977

ABSTRACT:
Securing a heat sink to an electronic device, such as an integrated circuit package, includes applying an adhesive layer to only a periphery of a surface on a thermal interface material. The thermal interface material is applied to the heat sink and/or integrated circuit package using the adhesive layer. The heat sink is in thermal contact with the integrated circuit package to extract heat during operation.

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patent: WO-0058683 (2000-10-01), None
patent: WO-05062688 (2005-07-01), None

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