Method of attaching LED chip to a header

Details Method of attaching LED chip to a header Method of attaching LED chip to a header

1978-12-04

1981-06-09

Dean, R.

Metal working

Method of mechanical manufacture

Assembling or joining

29569L, 29585, 29586, 29590, 357 66, 357 68, 357 81, H01L 21479

Patent

active

042715849

ABSTRACT:
A method of fabricating light emitting diodes to prevent degradation caused y thermally induced stress. A voltage is applied across the chip to cause it to bend to a prestressed condition while it is being soldered to the header. The biasing voltage applied is continued until after the heat is removed and the solder cooled leaving the diode in the prestressed condition.

REFERENCES:
patent: 3172188 (1965-03-01), Wood
patent: 3808674 (1974-05-01), Francombe
patent: 3843401 (1974-10-01), Carroll
patent: 3953920 (1976-05-01), Endo
patent: 4016644 (1977-04-01), Kurtz

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