Method of attaching leads to PTC devices

Details Method of attaching leads to PTC devices Method of attaching leads to PTC devices

1987-02-26

1988-11-29

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

29843, 29621, 219 93, 219 94, H01C 702

Patent

active

047871350

ABSTRACT:
A process for producing a PTC device comprising the steps of forming a laminate comprising a PTC composition and at least two electrode plates having the PTC composition sandwiched therebetween, opposing the surface of a lead plate to be electrically connected to each of the electrodes, to the surface of each of the electrode plates of the laminate while contacting at a narrow area, and then passing a current between the electrode and the lead via the narrow contact surface to weld them. By this process, there is obtained a PTC device having, at a portion of the joining interface between each electrode plate and each lead plate, a nugget formed by melting both the plates. This PTC device has a low contact resistance between the PTC composition and the electrode plates.

REFERENCES:
patent: 3231710 (1966-01-01), Barnet et al.

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