Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2005-08-02
2005-08-02
Nelms, David (Department: 2818)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C029S740000
Reexamination Certificate
active
06924174
ABSTRACT:
An electronic component attaching tool suitable for an external shape of a semiconductor device is prepared. The electronic component attaching tool has a function of aligning a position of the semiconductor device to an IC socket. The electronic component attaching tool is mounted on the standard surface that is formed on the IC socket substantially regardless of the external shape of the semiconductor device. The semiconductor device is then aligned and attached to the IC socket by using the electronic component attaching tool, and the electronic component attaching tool is removed from the IC socket. Another electronic component attaching tool suitable for an external shape of another semiconductor device is prepared, and the same procedure as the above is performed to align and attach this semiconductor device to the same type IC socket.
REFERENCES:
patent: 6539622 (2003-04-01), Hidese et al.
patent: 6769469 (2004-08-01), Yamada
patent: 6842974 (2005-01-01), Maenishi et al.
patent: 10-97887 (1998-04-01), None
Koizumi Daisuke
Maruyama Shigeyuki
Tashiro Kazuhiro
Watanabe Naoyuki
Fujitsu Limited
Lee Calvin
Nelms David
Westerman Hattori Daniels & Adrian LLP
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