Stock material or miscellaneous articles – All metal or with adjacent metals – Plural layers discontinuously bonded
Patent
1978-09-05
1982-07-06
Bell, James J.
Stock material or miscellaneous articles
All metal or with adjacent metals
Plural layers discontinuously bonded
29460, 228120, 228122, 228124, 228178, 427 34, 428 99, 428209, 428210, 428608, 428621, B32B 700
Patent
active
043383807
ABSTRACT:
A composite laminate capable of exposure to high temperature differentials without damage, comprising a first layer, a second layer and an intermediate web interface layer of a low modulus metallic low density structure having a high melting point. The first layer is secured to the low modulus structure directly or through an intermediate composite layer, and the second layer is bonded or secured to the intermediate low modulus layer. The thermal strains caused by a temperature differential between the first and second layers are taken up without harmful effect by the intermediate low modulus web layer.
REFERENCES:
patent: 2996401 (1961-08-01), Welch et al.
patent: 3114612 (1963-12-01), Friedrich
patent: 3127668 (1964-04-01), Troy
patent: 3815773 (1974-06-01), Duvall et al.
patent: 3843010 (1974-10-01), Morse et al.
patent: 3897624 (1975-08-01), Hamano
patent: 4055451 (1977-10-01), Cockbain et al.
patent: 4059712 (1977-11-01), Bothwell
patent: 4075364 (1978-02-01), Panzera
patent: 4142022 (1979-02-01), Erickson et al.
patent: 4149910 (1979-04-01), Popplewell
Erickson Arnold R.
Panzera Carlino
Tolokan Robert P.
Bell James J.
Brunswick Corporation
Heimovics John G.
LandOfFree
Method of attaching ceramics to metals for high temperature oper does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of attaching ceramics to metals for high temperature oper, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of attaching ceramics to metals for high temperature oper will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2168956