Method of attaching an interconnection plate to a...

Details Method of attaching an interconnection plate to a... Method of attaching an interconnection plate to a...

2009-10-27

2011-12-13

Smith, Zandra (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S106000, C438S110000, C438S111000, C257S666000, C257S670000, C257S676000, C257S692000, C257SE23047

Reexamination Certificate

active

08076183

ABSTRACT:
A method is disclosed for attaching an interconnection plate to semiconductor die within leadframe package. A base leadframe is provided with die pad for attaching semiconductor die. An interconnection plate is provided for attachment to the base leadframe and semiconductor die. Add a base registration feature onto base leadframe and a plate registration feature onto interconnection plate with the registration features designed to match each other such that, upon approach of the interconnection plate to base leadframe, the two registration features would engage and guide each other causing concomitant self-aligned attachment of the interconnection plate to base leadframe. Next, the interconnection plate is brought into close approach to base leadframe to engage and lock plate registration feature to base registration feature hence completing attachment of the interconnection plate to semiconductor die and forming a leadframe package.

REFERENCES:
patent: 5889318 (1999-03-01), Corisis
patent: 6075283 (2000-06-01), Kinsman et al.
patent: 6225683 (2001-05-01), Yalamanchili et al.
patent: 6635138 (2003-10-01), Choi
patent: 6815806 (2004-11-01), Awad et al.
patent: 7239009 (2007-07-01), Kiyohara

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