Method of attaching an electronic device to an MLCC having a...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S830000, C029S840000, C029S854000

Reexamination Certificate

active

07958627

ABSTRACT:
A method of forming an electrical component is provided. The method comprises preparing a subassembly by electrically connecting an integrated circuit to a flexible circuit; and attaching the subassembly to a multilayer ceramic capacitor having a mounting surface with a curvature deviation exceeding 0.008 inches per inch.

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patent: 6336365 (2002-01-01), Blackadar et al.
patent: 6391230 (2002-05-01), Sarbadhikari
patent: 6785121 (2004-08-01), Nakano et al.
patent: 7117588 (2006-10-01), Vafi et al.
patent: 7152314 (2006-12-01), Shuto et al.
patent: 7561438 (2009-07-01), Liu
patent: 2004/0231885 (2004-11-01), Borland et al.
patent: 2008/0192452 (2008-08-01), Randall et al.
patent: 2008/100940 (2008-02-01), None

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