Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1990-02-21
1991-12-31
Weston, Caleb
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156 89, 160 113, 160 114, 252514, 501 19, 501 32, 501 46, B32B 3106
Patent
active
050768760
ABSTRACT:
A stable Tl.sub.2 O.sub.3, V.sub.2 O.sub.5, P.sub.2 O.sub.5 glass composition for a die attach paste requiring no resin and having a glassy edge temperature of below about 350.degree. C.
REFERENCES:
patent: 2385580 (1945-09-01), Knox
patent: 3088833 (1963-05-01), Pirooz
patent: 3454408 (1969-07-01), Busdiecker
patent: 3480566 (1969-11-01), Hoffman
patent: 3497774 (1967-06-01), Hornberger et al.
patent: 3650778 (1972-03-01), Dumesnil et al.
patent: 3703386 (1972-11-01), Dietz
patent: 3787218 (1974-01-01), Dietz et al.
patent: 3837866 (1974-09-01), Malmendier et al.
patent: 4002799 (1977-01-01), Dumesnil et al.
patent: 4401767 (1983-08-01), Dietz et al.
patent: 4459166 (1984-07-01), Dietz et al.
patent: 4743302 (1988-05-01), Dumesnil et al.
patent: 4761224 (1988-08-01), Husson, Jr. et al.
JMI AuSub Die Attach Paste (Johnson Matthey Electronic Materials Div.).
Development of Adhesive Die Attach Technology in Cerdip Packages; Material Issues*, F. K. Moghadam, Jan. '84.
New Die Attach Material for Hermetic Packaging, R. L. Dietz and L. Winder, 1983.
Diemat, Inc.
Liniak Thomas P.
Weston Caleb
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