Method of attaching a protective film to an integrated circuit

Details Method of attaching a protective film to an integrated circuit Method of attaching a protective film to an integrated circuit

1981-06-01

1983-06-14

Dawson, Robert A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29829, 156295, 174 35R, 174 685, 339 17A, 339 17B, 339 17T, 339143R, 428192, B32B 3112, B32B 712

Patent

active

043881327

ABSTRACT:
In the disclosed method, a protective film is attached to an integrated circuit by the steps of placing a droplet of an adhesive on the surface of the integrated circuit; dropping the film on the droplet of adhesive; squeezing the droplet into a layer with the weight of the film; and aligning corresponding edges of the film and integrated circuit via the surface tension in the adhesive.

REFERENCES:
patent: 3193424 (1965-07-01), Scott
patent: 3852690 (1974-12-01), Telfer
patent: 3963551 (1976-06-01), Marlinski

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