Metal working – Method of mechanical manufacture – Electrical device making
Patent
1998-08-17
2000-01-11
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29825, 174255, H05K 336
Patent
active
060122218
ABSTRACT:
A novel method for bonding a flexible circuit to a substrate is provided. The method uses an adhesive that is curable upon exposure to actinic radiation of a preselected wavelength, and a flexible circuit that comprises a dielectric layer made from a material that is transmissive to actinic radiation of the preselected wavelength and at least one conductive layer disposed on a surface of the dielectric layer. The conductive layer has at least one opening therethrough to allow passage of the actinic radiation through the flexible circuit. The method also employs a substrate which comprises a top surface defining a mating region and at least one channel, and a side surface defining at least one port which is in communication with the channel. In one embodiment, the method comprises the steps of dispensing the adhesive in the channels of the substrate; aligning the flexible circuit with the substrate so that at least a portion of one opening in the conductive layer of the flexible circuit overlays a portion of one or more channels in the substrate; contacting the flexible circuit with the mating region of the substrate; and directing actinic radiation through the flexible circuit for a sufficient time to cure the adhesive and to provide the circuit board assembly. In another embodiment, the flexible circuit is aligned with and placed on the mating region of substrate before the adhesive is injected into the channels of the substrate via the ports which are present in the side surface.
REFERENCES:
patent: 3039177 (1962-06-01), Burdett
patent: 4985600 (1991-01-01), Heerman
patent: 5157828 (1992-10-01), Coques et al.
patent: 5317438 (1994-05-01), Suzuki et al.
patent: 5415555 (1995-05-01), Sobhani
patent: 5486655 (1996-01-01), Arike et al.
patent: 5526563 (1996-06-01), Tamaki et al.
IBM Technical Disclosure Bulletin, vol. 38, No. 02, Feb., 1995.
Arbes Carl J.
International Business Machines - Corporation
Lucas James A.
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