Method of assessing bond integrity in bonded structures

Details Method of assessing bond integrity in bonded structures Method of assessing bond integrity in bonded structures

2011-08-23

2011-08-23

Connolly, Patrick J (Department: 2877)

Optics: measuring and testing

By light interference

For dimensional measurement

C073S657000

Reexamination Certificate

active

08004689

ABSTRACT:
A technique for acoustic detection of a disbond within a bonded structure involves thermal excitation of the surface of the bonded structure to induce a lifting and membrane vibration and is applicable to laminates and coated structures, as well as foam core structures or a honeycomb structures. The technique does not require access to both sides of the bonded structure. A large etendue interferometer is used to provide surface displacement measurement. The surface displacement measurement can be analyzed both by frequency or amplitude to determine existence of a disbond by membrane vibration, and further a thickness of the disbond can be determined using traditional pulse-echo time analysis. The technique may allow detection of stick bonds.

REFERENCES:
patent: 6181431 (2001-01-01), Siu
patent: 6490047 (2002-12-01), Siu

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