Method of assembly using array of programmable magnets

Details Method of assembly using array of programmable magnets Method of assembly using array of programmable magnets

2008-06-20

2010-06-15

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Magnetic field

C257S421000, C257SE29167, C257SE29323

Reexamination Certificate

active

07737515

ABSTRACT:
Systems and methods for assembling a structure onto a substrate include an array of programmable magnets disposed beneath a substrate, wherein a magnetic field is applied to the structure to levitate the structure above the substrate while the structure is moved relative to the substrate to align the structure with a corresponding recess formed in the substrate. A magnetic field may be applied to translate and rotate the structure relative to the substrate. Differences between or among the programmable magnets regarding magnetic polarity, energized versus de-energized status, and magnetic field strength may be used to move the structure relative to the substrate in conjunction with a closed-loop control system. A bonded substrate assembly and a method of bonding a first wafer to a second wafer include wherein the first wafer includes a projection and the second wafer includes a matching depression. The first and second wafers are bonded together at least in part via magnetic attraction between respective magnetic layers in the projection and the depression.

REFERENCES:
patent: 4542397 (1985-09-01), Biegelsen et al.
patent: 5034802 (1991-07-01), Liebes, Jr. et al.
patent: 5962975 (1999-10-01), Lepselter
patent: 6072251 (2000-06-01), Markle
patent: 6650079 (2003-11-01), Binnard
patent: 6833277 (2004-12-01), Fonstad, Jr. et al.
patent: 6888178 (2005-05-01), Fonstad et al.
patent: 7217592 (2007-05-01), Nuggehalli et al.
patent: 7321159 (2008-01-01), Schatz
patent: 2003/0098965 (2003-05-01), Binnard et al.
patent: 2007/0268475 (2007-11-01), Binnard
patent: 2008/0067968 (2008-03-01), Binnard et al.
patent: 2008/0275661 (2008-11-01), Yang et al.
patent: 2008/0285004 (2008-11-01), Binnard et al.
patent: 2008/0285005 (2008-11-01), Gery et al.
patent: 2009/0001907 (2009-01-01), Hosek et al.
patent: 2009/0296069 (2009-12-01), Shibazaki
patent: WO 2005/089184 (2005-09-01), None
patent: WO 2005/089184 (2005-09-01), None
Sudhakar,et al., The Magnetic Field-Assisted Assembly of Nanoscale Semiconductor Devices: A New Technique, JOM, Oct. 2004, pp. 32-34.

Affiliated with

Also associated with

Rating

Method of assembly using array of programmable magnets does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of assembly using array of programmable magnets, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of assembly using array of programmable magnets will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4233398