Method of assembly of microwave integrated circuits having a str

Details Method of assembly of microwave integrated circuits having a str Method of assembly of microwave integrated circuits having a str

1979-04-20

1980-12-30

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29407, 29589, 29593, 156152, 156298, 156299, 156327, 156329, G01R 3126

Patent

active

042421578

ABSTRACT:
One or more MIC's (microwave integrated circuits) are included in an assembly having a structurally continuous ground plane of conductive material for the microwave circuitry. Individual MIC's are mounted on a carrier and attached thereto by a layer of a dielectric adhesive. The adhesive is in contact with and interposed between the lower side of each MIC substrate and the carrier which may be, for example, a metal chassis. The carrier serves as, or includes, the structurally continuous ground plane of conductive material. Ground plane metallization on the lower side of MIC substrates is thereby made unnecessary. The dielectric adhesive may be maintained in a liquid or tacky state to permit convenient removal from the assembly of an MIC requiring rework or replacement. In addition, the layer of dielectric adhesive provides a thermally conductive path between an MIC and the carrier making the invention particularly well suited for MIC assemblies which are intended to be operated in a vacuum.

REFERENCES:
patent: 2708650 (1955-05-01), Pullman et al.
patent: 2731378 (1956-01-01), Strachan
patent: 2925193 (1960-02-01), Gibb
patent: 3581375 (1971-06-01), Rottmann
patent: 3604108 (1971-09-01), Mallery
patent: 3615946 (1971-10-01), Palmer
patent: 3658618 (1972-04-01), Gramann
patent: 3693252 (1972-09-01), Robertson et al.
patent: 3992236 (1976-11-01), Wanesky
patent: 4102039 (1978-07-01), Henrickson et al.

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