Method of assembly of a wedge thermal interface to allow...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C165S185000, C257S707000, C257S719000, C361S710000

Reexamination Certificate

active

07120023

ABSTRACT:
A variable-height thermal-interface assembly for transferring heat from a heat source to a heat sink comprises a slidable interface between two contacting surfaces, the slidable interface inclined diagonally relative to the z-axis. The two contacting surfaces slide relative to one another parallel to the incline direction to provide z-axis expansion of the assembly. The assembly further comprises a spring clip, which when released applies a shear force across the slidable interface, causing the two contacting surfaces to slide relative to one another, coupling the sliding to provide z-axis expansion. The assembly further comprises a reversible locking device, which when locked prevents the two contacting surfaces from sliding relative to one another, such that the spring clip remains retracted, and when unlocked allows the two contacting surfaces to slide relative to one another, such that the spring clip is released.

REFERENCES:
patent: 3366171 (1968-01-01), Scharli
patent: 3804676 (1974-04-01), Sell, Jr.
patent: 4414605 (1983-11-01), Chino et al.
patent: 4867235 (1989-09-01), Grapes et al.
patent: 4872089 (1989-10-01), Ocken et al.
patent: 4953059 (1990-08-01), McNulty
patent: 5162974 (1992-11-01), Currie
patent: 5184281 (1993-02-01), Samarov et al.
patent: 5887435 (1999-03-01), Morton
patent: 6480386 (2002-11-01), Yu
White, Joseph M., et al., “Variable Height Thermal Interface,” U.S. Appl. No. 10/649,519, filed Aug. 25, 2003 concurrently herewith.
Rubenstein, Brandon A., Heat Sink Hold-Down with Fan-Module Attach Location,: U.S. Appl. No. 10/419,386, filed Apr. 21, 2003.
Delano, Andrew D., et al., “Variable-Gap Thermal-Interface Device,” U.S. Appl. No. 10/419,373, filed Apr. 21, 2003.
Delano, Andrew D., et al., “Variable-Wedge Thermal-Interface Device,” U.S. Appl. No. 10/419,406, filed Apr. 21, 2003.
Belady, Christian L., et al., Thermal Transfer Interface System and Methods, U.S. Appl. No. 10/074,642, filed Feb. 12, 2002.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of assembly of a wedge thermal interface to allow... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of assembly of a wedge thermal interface to allow..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of assembly of a wedge thermal interface to allow... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3629599

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.