Method of assembly for small electrical devices

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29622, 439 61, 439493, 445123, H05K 336, H01H 1100

Patent

active

050939858

ABSTRACT:
A method of assembly for small electrical devices which enhances automated assembly opportunities while reducing costly and nonuniform hand operations, by including the use of flexible connectors, anisotropic adhesives, three dimensional molded circuit boards and elastomeric connectors.

REFERENCES:
patent: 4219928 (1980-09-01), Kuo
patent: 4241371 (1980-12-01), Sage
patent: 4283593 (1981-08-01), Piasecki et al.
patent: 4296489 (1981-10-01), Mitsui
patent: 4380357 (1983-04-01), Evans et al.
patent: 4464832 (1984-08-01), Asick et al.
patent: 4465378 (1984-08-01), Maurer et al.
patent: 4540907 (1985-09-01), Hagenlocher et al.
patent: 4588456 (1986-05-01), Dery et al.
patent: 4642421 (1987-02-01), Dery et al.
patent: 4659872 (1987-04-01), Dery et al.
patent: 4676854 (1987-06-01), Suzuki et al.
patent: 4795895 (1989-01-01), Hara et al.
patent: 4801768 (1989-01-01), Sugiyama et al.
patent: 4812135 (1989-03-01), Smith
patent: 4838798 (1989-06-01), Evans et al.
patent: 4928206 (1990-05-01), Porter et al.
patent: 4931598 (1990-06-01), Calhoun et al.
patent: 4942364 (1990-07-01), Nishijima et al.
patent: 4964693 (1990-10-01), Branan et al.
patent: 4964700 (1990-10-01), Takabayashi
"Anisotropic Conductive Layers, Nippon Graphite Industries, Ltd.", Promotional Sales Literature.
"Anisotropic Adhesives: Screen Printed Electronic Assembly", Site Magazine, Ken Gilleo.
"Display/Driver Interconnections Using Conductive Hot Adhesives", by Reinke and Kennedy.
"High Volume Manufacturing of Three Dimensional Molded Circuit Board Products", by Frisch et al.
"Designing Tools and Fixtures for Molded Circuits and Three Dimensional Devices", by Frisch et al.
"Selectively Conductive Molded Devices From Pathtek", sales literature from Pathtek.
"Three Dimensional Molded Interconnects for Document Sensing", by Ramansky et al., Pathtek.
"Pathtek 3-D Molded Device Facility Ready For Production", sales literature from Pathtek.
"3-D Circuitry Enhances Injection Molded Boards", ICI Americas, Inc., Reprint from Electronics Product Magazine (8/1/85).
"Victrex For Molded Circuit Boards", sales literature from Imperial Chemical Industries, PLC (1985).
"Molded Circuit Boards Compete for High Volume Markets", reprint, Electronics Packaging and Production (6/86).
"Printed Circuit Fabrication, Injection Molded Thermal Plastic Boards", reprint, Circuit Fabrication, vol. 9, No. 7 (7/86).
"ICI Electronics Group, 3-D Molded Circuit Boards", sales literature from ICI Americas, Inc. (1987).
"Hewlett Packard Custom LED Display Solutions", sales literature from Hewlett Packard.
"Elite", sales literature from Elite, a Dupont Company.
"Engineering Design with Dupont Polymers".

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of assembly for small electrical devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of assembly for small electrical devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of assembly for small electrical devices will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2277484

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.