Method of assembling pagewidth printhead

Details Method of assembling pagewidth printhead Method of assembling pagewidth printhead

2011-01-25

2011-01-25

Wyrozebski, Kat (Department: 1791)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S060000, C156S182000

Reexamination Certificate

active

07875139

ABSTRACT:
A method of assembling a pagewidth printhead. The method includes: aligning a multilayered adhesive film an said ink supply manifold such that ink supply holes in the film are aligned with respective ink outlets in the ink supply manifold; bonding a first adhesive layer of the film to a manifold bonding surface; heating a printhead integrated circuit and positioning the heated printhead integrated circuit on an opposite side of the film such that each ink supply hole is aligned with an ink inlet defined in a printhead bonding surface of the printhead integrated circuit; and repeatedly bonding printhead integrated circuits to the film to provide the pagewidth printhead.

REFERENCES:
patent: 7225739 (2007-06-01), Silverbrook et al.
patent: 2003/0178221 (2003-09-01), Chiu et al.
patent: 2007/0058007 (2007-03-01), Silverbrook et al.
patent: 2007/0206059 (2007-09-01), Ramachandra et al.
patent: 0671372 (1995-09-01), None
patent: 2007/098861 (2007-04-01), None

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