Method of assembling multi-layer LED array engine

Details Method of assembling multi-layer LED array engine Method of assembling multi-layer LED array engine

2011-04-12

2011-04-12

Trinh, Michael (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

C438S027000, C438S028000, C438S029000

Reexamination Certificate

active

07923271

ABSTRACT:
A method of assembling a multi-layer LED array engine is provided. The method includes the steps of: preparing a base plate frame comprising at least one lighting area, and two lead frame grooves; positioning two lead frames inside accommodating spaces defined in the two lead frame grooves, respectively; executing an injection molding process to form a molded platform on the base plate frame; configuring a thin layer of nickel or chromium; arranging a plurality of LED dice in an array form on an upper surface of the base plate frame; electrically coupling the LED dice to the lead frames by bonded wires; forming a protection layer on the LED dice and the bonded wires; forming a phosphorous layer on the protection layer, wherein the phosphorous layer is formed within a range defined by the phosphorous wall; and forming a dome on the upper surface of the molded platform by executing an injection molding process.

REFERENCES:
patent: 7161189 (2007-01-01), Wu
patent: 7709857 (2010-05-01), Kim et al.
patent: 2006/0102917 (2006-05-01), Oyama et al.
patent: 2010/0314654 (2010-12-01), Hayashi

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