Method of assembling micromechanical sensors

Details Method of assembling micromechanical sensors Method of assembling micromechanical sensors

1992-01-30

1993-12-28

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437 64, 437 65, 437133, 437195, H10L 2160

Patent

active

052739392

ABSTRACT:
A method is proposed for assembling micromechanical sensors, in particular Hall sensors, or pressure or acceleration sensors, in which at least one silicon sensor element is applied to a substrate. The at least one silicon sensor element is joined to the substrate via at least one assembly pedestal, the cap faces of which are kept small compared with the surface of the silicon sensor element, so that a gap exists between the substrate and the silicon sensor element except for the region of the at least one assembly pedestal.

REFERENCES:
patent: 4257274 (1981-03-01), Shimada
patent: 4326188 (1982-04-01), Dahlberg
patent: 4398342 (1983-08-01), Pitt et al.
patent: 4620365 (1986-11-01), Burger et al.
patent: 4670092 (1987-06-01), Motamedi
patent: 4881410 (1989-11-01), Wise
patent: 5071510 (1991-12-01), Findler et al.
Anton Heuberger, Micromechanik, 1989, pp. 470-477, published by Springer Verlag, Berlin-Heidelberg-NY-Paris-Tokyo.

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