Method of assembling integrated circuit components

Details Method of assembling integrated circuit components Method of assembling integrated circuit components

2008-09-30

2011-10-18

Lee, Hsien Ming (Department: 2823)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C438S458000, C438S460000, C438S462000, C438S463000, C257SE21003, C257SE21087

Reexamination Certificate

active

08039360

ABSTRACT:
The disclosure identified as methods of mounting integrated circuits, including solar cells, to a substrate wherein the circuits are mounted prior to being singulated into discrete die. Once the semiconductor die sites or other circuits are formed on a wafer, the wafer will be attached, either whole, or divided into one or more multi-die site wafer segments, to a substrate. This attachment may be by conventional surface mount technology, for example. After such mounting, the individual die sites on the wafer segments will be singulated to form discrete die already mounted to the supporting substrate. The singulation may be preferably performed by laser dicing of the wafer segments.

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