Method of assembling elements by localized heating

Details Method of assembling elements by localized heating Method of assembling elements by localized heating

2006-04-18

2006-04-18

Geyer, Scott (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Reexamination Certificate

active

07029990

ABSTRACT:
The invention relates to a process of assembly of at least two silicon substrates. The method comprises:a step of placing in contact a first silicon substrate (9) with a second silicon substrate (10), the first and second substrates (9, 10) being substantially non-transparent for a wavelength λ of laser radiation (R), anda step of illuminating the first silicon substrate (9) with a laser beam of wavelength λ to create a fusion path (21), along the laser beam axis (A1-A2), in the thickness of the first substrate (9) and in all or part of the thickness of the second substrate (10).The invention is applied to the sealing of cavities and of mechanical or electrical joints situated at the interface of two silicon substrates.

REFERENCES:
patent: 4634832 (1987-01-01), Martyr
patent: 4866242 (1989-09-01), Martyr
patent: 5009689 (1991-04-01), Haisma et al.
patent: 6049054 (2000-04-01), Panchison et al.
patent: 6163011 (2000-12-01), Urushizaki et al.
patent: 38 20 848 (1989-04-01), None
patent: 4219132 (1993-12-01), None
patent: 2 074 070 (1981-10-01), None
patent: 61169183 (1986-07-01), None
patent: 2000313630 (2000-11-01), None
patent: WO 02/070188 (2002-09-01), None
International Search Report dated Jul. 12, 2002.

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