Method of assembling electronic component

Metal working – Method of mechanical manufacture – Electrical device making

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Details

29827, 439 70, 439 71, H05K 334

Patent

active

056471211

ABSTRACT:
A socket system that comprises a printed circuit board; an electrical module; and a socket having a hollow core. The socket holds the electrical module and is capable of electrically coupling the electrical module to the printed circuit board. The electrical module has at least one electrical lead. The socket has at least one electrical lead capable of electrically coupling with the electrical lead(s) of the electrical module. The electrical module comprises a second printed circuit board having a first and second surface; a lithium battery positioned on the first surface of the second printed circuit board and electrically coupled with the second printed circuit board, a crystal positioned on the first surface of said second printed circuit board and electrically coupled with the second printed circuit board, and an integrated circuit positioned on the second surface of the second printed circuit board.

REFERENCES:
patent: 4142287 (1979-03-01), Grabbe
patent: 4371912 (1983-02-01), Guzik
patent: 4646435 (1987-03-01), Grassover
patent: 4648666 (1987-03-01), Lovell
patent: 4677458 (1987-06-01), Morris
patent: 4718855 (1988-01-01), Billman et al.
patent: 4759491 (1988-07-01), Fisher
patent: 4876465 (1989-10-01), Podkowa et al.
patent: 4959646 (1990-09-01), Podkowa et al.
patent: 5005501 (1991-04-01), Podkowa
patent: 5050113 (1991-09-01), Podkawa et al.
patent: 5197142 (1993-03-01), Williamm et al.

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