Method of assembling components on printed circuit boards

Metal treatment – Compositions – Fluxing

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Details

B23K 3534

Patent

active

041135245

ABSTRACT:
An improved method of assembling components on printed circuit boards whereby trimmed component leads are placed into holes in the printed circuit board, and an extrudable, non-flowing, heat resistant, completely water soluble mixture is applied over and around the components to keep them in place. The components are then soldered to the board and the extrudable mixture washed away with water. The mixture is made from a solid polyalkylene glycol, an alkali metal soap, glycerine and water.

REFERENCES:
patent: 1083828 (1914-01-01), Hammar
patent: 2266060 (1941-12-01), Miller
patent: 2277064 (1942-03-01), Bialosky
patent: 3622383 (1971-11-01), Dane
patent: 3734791 (1973-05-01), Poliak

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