Method of assembling compact silicon module for high density int

Details Method of assembling compact silicon module for high density int Method of assembling compact silicon module for high density int

1991-05-10

1992-09-08

Eley, Timothy V.

Metal working

Method of mechanical manufacture

Electrical device making

29832, 29837, H05K 114

Patent

active

051447460

ABSTRACT:
A semiconductor module that densely packs integrated circuit chips to provide electronic systems or large memory modules in an array of stacked silicon boards. The semiconductor chips may be flip mounted and the back side of each chip is in thermal contact with an adjacent silicon board to provide heat conduction away from the chip.

REFERENCES:
patent: 3300686 (1967-01-01), Johnson et al.
patent: 3312878 (1967-04-01), Poch et al.
patent: 3372309 (1968-03-01), Stockdale
patent: 3437882 (1969-04-01), Cayzer
patent: 4922378 (1990-05-01), Malhi et al.
patent: 4979075 (1990-12-01), Murphy

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