Method of assembling carbon nanotube reinforced solder caps

Details Method of assembling carbon nanotube reinforced solder caps Method of assembling carbon nanotube reinforced solder caps

2006-09-29

2009-10-13

Stoner, Kiley (Department: 1793)

Metal fusion bonding

Process

Plural joints

C228S246000, C228S248100

Reexamination Certificate

active

07600667

ABSTRACT:
A method of making a carbon nanotube reinforced solder cap. Carbon nanotube-solder (CNT-S) particles are transferred from a transfer substrate, having an adhesive layer, to a solder bump by using thermo compression bonding. The CNT-S particles are then reflowed to form a cap on the solder bump. The solder bump with the reflowed cap can then be joined to a bonding pad or another solder bump with a cap by placing the solder bump on the pad or other bump and reflowing at a temperature sufficient to reflow the cap(s).

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Hwang, C.-W., “Carbon Nanotube Reinforced Metallic Layer”, U.S. Appl. No. 11/292,690, filed Dec. 2, 2005.

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