Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1972-08-28
1976-12-07
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
156220, 156222, 156251, 156267, 156273, 156306, B32B 3118, B32B 3120, B32B 3122
Patent
active
039960889
ABSTRACT:
A method of assembling and embossing a multiple layer workpiece has, in a most complete conception, a first die having die surfaces for defining periphery of an area portion to be embossed on the workpiece which engages a blank to mark the blank with the die surfaces. Means are then located on the blank relative to the mark for operating on the blank to make a model of the desired workpiece from the blank. A second die is made conformably with the model. Workpiece layers are then assembled in overlapping relation and welded together by the first die along the periphery of the area porton defined by the die surfaces. Portions of one layer outside the welded periphery are then removed to leave the area portion covered by the one layer and secured to the other about the periphery of the area portion. The second die is then registered with the workpiece, the workpiece embossed into conformity with the second die and the one layer welded to the other layer over the entire area portion to form an embossed multiple layer workpiece.
REFERENCES:
patent: 2726941 (1955-12-01), Markus et al.
patent: 2729009 (1956-01-01), Markus et al.
patent: 2729010 (1956-01-01), Markus et al.
patent: 3053960 (1962-09-01), Spieles
patent: 3200025 (1965-08-01), Edmondson
patent: 3244571 (1966-04-01), Weisman
patent: 3301728 (1967-01-01), Swartz
patent: 3535182 (1970-10-01), Meier-Maletz
patent: 3537874 (1970-11-01), Ramey
patent: 3547724 (1970-12-01), Zagusta
patent: 3616026 (1971-10-01), Larsen
patent: 3629035 (1971-12-01), Kuroda
patent: 3701707 (1972-10-01), Scholl et al.
patent: 3705071 (1972-12-01), Gras
patent: 3711362 (1973-01-01), Ballard
Brine Aubrey C.
Lewris Basil J.
Megley Richard B.
Powell William A.
USM Corporation
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