Method of assembling an optocoupler

Fishing – trapping – and vermin destroying

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437906, 437 8, 437209, 357 17, 357 19, 250551, H01L 3112

Patent

active

047554746

ABSTRACT:
A method of manufacturing optocoupler devices is provided wherein individual light emitting chips are mounted to a plurality of photodetector chips still in wafer form such that testing of the emitter detector pairs may be accomplished prior to dicing of the photodetector chip and mounting of the emitter detector pairs.

REFERENCES:
patent: 4058821 (1977-11-01), Miyoshi et al.
patent: 4100562 (1978-07-01), Sugawara et al.
patent: 4136351 (1979-01-01), Sugawara et al.
patent: 4156148 (1979-05-01), Kaufman
patent: 4160308 (1979-07-01), Courtney et al.
patent: 4478588 (1984-10-01), Lockard
patent: 4590667 (1986-05-01), Simon
patent: 4633582 (1987-01-01), Ching et al.

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