Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-08-21
2011-12-06
Banks, Derris (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S831000, C029S832000, C029S846000, C029S847000, C029S852000
Reexamination Certificate
active
08069559
ABSTRACT:
An insulated metal substrate laminate includes a metal substrate, a dielectric layer disposed upon the metal substrate, wherein the dielectric layer comprises a thermoplastic film having a thickness of less than or equal to 10 micrometers, a thermal resistance of less than or equal to 0.050 Kelvin-square inches per watt, and a breakdown voltage greater than or equal to 1000 volts (alternating current), and an electrically conductive layer disposed upon the dielectric layer.
REFERENCES:
patent: 5716713 (1998-02-01), Zsamboky et al.
patent: 5800724 (1998-09-01), Habeger et al.
patent: 7303005 (2007-12-01), Reis et al.
patent: 7365988 (2008-04-01), Reis et al.
patent: 7416019 (2008-08-01), Osiander et al.
patent: 2003/0221860 (2003-12-01), Van Der Burgt et al.
patent: 2004/0234699 (2004-11-01), Hale et al.
patent: 2006/0048963 (2006-03-01), Nishinaka et al.
patent: 2006/0185140 (2006-08-01), Andresakis et al.
patent: 2006/0231837 (2006-10-01), Wuchse et al.
patent: PCT/US2008/059983 (2008-04-01), None
International Search Report and Written Opinion for PCT application No. PCT/US2008/073955 filed on Aug. 22, 2008.
Banks Derris
Cantor & Colburn LLP
Nguyen Tai
World Properties, Inc.
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