Method of assembling an encapsulated chip capacitor

Details Method of assembling an encapsulated chip capacitor Method of assembling an encapsulated chip capacitor

1979-10-22

1981-08-11

Walton, Donald L.

Metal working

Method of mechanical manufacture

Assembling or joining

29583, 29588, H01L 2164

Patent

active

042826454

ABSTRACT:
An encapsulated chip capacitor is made by inserting capacitor bodies between two channels of L-shaped cross-section, electrically connecting the capacitor cathodes to one channel and the anodes to the other thus providing terminals, filling the resulting assembly with insulating encapsulant, curing it, and separating the cured assembly into individual chip capacitors.

REFERENCES:
patent: 3345544 (1967-10-01), Metcalfe
patent: 3550228 (1970-12-01), Asscher
patent: 3781976 (1974-01-01), Tomiwa
patent: 3855505 (1974-12-01), Karlik et al.
patent: 4059887 (1977-11-01), Galvagni
patent: 4065611 (1977-12-01), Sobozenski et al.
patent: 4097915 (1978-06-01), Locke

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