Method of assembling an EMI shield around an electronic componen

Metal working – Method of mechanical manufacture – Electrical device making

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174 35R, H05K 330

Patent

active

057041172

ABSTRACT:
An EMI shield for a component mounted upon a printed circuit board. The shield is an open sided box made from plastic insulating material supporting an electrically conductive shield layer. A surrounding flange is provided by the plastic at the open side of the box, the flange having a surface facing outwards in the same direction as the open side. The conductive shield layer extends onto the outward facing surface.

REFERENCES:
patent: 4967311 (1990-10-01), Ferchau et al.
patent: 5014160 (1991-05-01), McCoy, Jr.
patent: 5323298 (1994-06-01), Shatas et al.
patent: 5323299 (1994-06-01), Weber
patent: 5335147 (1994-08-01), Weber
patent: 5354951 (1994-10-01), Lange, Sr. et al.

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